ICS Seminar: Wolfgang Kunz
System- versus RT-Level Verification of Systems-on-Chip by Compositional Path Predicate Abstraction
Speakers: Joakim Urdahl, Dominik Stoffel, Wolfgang Kunz
Dept. of Electrical & Computer Engineering
Technische Universität Kaiserslautern
ACES 2.402
Wednesday, October 10
4:30 – 5:30 p.m.
Abstract
We propose a new methodology to create a formal relationship between a time-abstract system-level description of a System-on-Chip (SoC) and its Register-Transfer Level (RTL) implementation. This formal relationship, called path predicate abstraction, is a weak form of a bisimulation and can be obtained by standard property checking techniques when applied in a systematic way. The proposed concepts can be used for bottom-up system verification as well as for top-down design refinements.
Since our methodology considers time-abstract system models individually for each SoC module there is the challenge to deal with the concurrency between the individual RTL components. We propose a compositional scheme describing the communication between SoC modules independently of their individual processing speed. The composed abstract system is modeled by an asynchronous composition and can be verified using the SPIN model checker.
We demonstrate the practical feasibility of our approach by a comprehensive case study based on Infineon’s FPI Bus. We show that SPIN in combination with our methodology is able to prove global system properties for the RTL implementation consisting of several concurrent SoC modules and containing thousands of state variables.
ICS Seminar: Dr. Ruchir Puri, IBM Fellow
Wednesday, October 3, 2012
2:00 PM (1:30pm Reception)
NHB 1.720
(NHB – Norman Hackerman Building is diagonally across the ACES Building at the intersection of 24th and Speedway)
Opportunities and Challenges for High Performance Microprocessor Designs and Design Automation
With end of an era of classical technology scaling and exponential frequency increases, high end microprocessor designs and design automation methodologies are at an inflection point. With power and current demands reaching breaking points, and significant challenges in application software stack, we are also reaching diminishing returns from simply adding more cores. In design methodologies for high end microprocessors, although chip physical design efficiency has seen tremendous improvements, strong indications are emerging for maturing of those gains as well. In order to continue the cost-performance scaling in systems in light of these maturing trends, we must innovate up the design stack, moving focus from technology and physical design implementation to new IP and methodologies at Logic, architecture, and at the boundary of hardware and software, solving key bottlenecks through application acceleration. This new era of innovation, which moves the focus up the design stack presents new challenges and opportunities to the design and design automation communities. This talk will motivate these trends and focus on challenges for high performance microprocessor design and design automation in the years to come.
Speaker Biography |